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UV DRY PROCESSOR
Materials ranging from thin glass substrates to
macromolecular plastics are precision cleaned.
Ultraviolet cleaning technology uses ultraviolet light and ozone. The
ORC Dry Processor uses ultraviolet light to decompose organic contaminants on the
processed surface. Free radicals of excited substances or contaminants generated
by the photo-decomposition reaction react with atomic oxygen (O) generated from
O3 to remove (vaporize)
simple molecules, such as CO2, H2O,
N2 and O2.
Better Wet-ability
Cleaning the surface of an object with ultraviolet light gives better wet ability
with solvents such as water, similar to cleaning the surface with a surfactant.
Stronger Adhesion
Cleaning the surface of an object with ultraviolet light activates the surface
to provide better links with adhesive molecules.
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details, please contact us. => |
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Batch Process Equipment |
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VUM-3333-A |
HMW-615N |
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1) Changing the irradiation distance of a
lamp enables the processing of substrate of all shapes
2) Capable of processing up to 630(W)x400(D)x150(H) mm
substrate |
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1) Batch processing facilitates the
processing of substrate.
2) Capable of processing up to 300(W)x300(D) substrate
=> HMW-615N-3, 400(W)x400(D) mm substrate => HMW-615N-4
3) Capable of purging N2 |
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VUM-3073 Series |
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1) Compact unit and suitable for
experimentation
2) Capable of processing up to 200(W) x200(D) mm
substrate. |
| VUM-3073-B |
VUM-3073-D |
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If you would like to know more
details, please contact us. => |
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In-Line Process Equipment |
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VUM-3164-B |
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1) By changing irradiance
distance, this processes variety of substrates.
2) Using high power lamps and
higher conveyor speed. |
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VUM-3345 |
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1) Using higher power lamps,
cleaning power becomes higher; thus, it offers high speed cleaning.
2) Using clean transportation
methods, it minimizes dusts/particles.
3) Using a special
transportation system that holds both edges of substrates, it refrains
from scratches and contamination.
4) It handles substrates with
width from 250 to 400 mm (adjustable). |
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HMW-667 |
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1) Can be used for both in-line
and off-line (equipped with loader and unloader)
2) Maximum irradiation width of
300 mm |
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